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INSIDE debuts new MicroPass Platform

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Published on 04 April 2008
INSIDE debuts new MicroPass Platform

INSIDE Contactless has launched the MicroPass 4000 contactless microprocessor family, a next-generation platform designed to bring a host of new contactless applications to mainstream markets in the US and elsewhere, with two initial product offerings intended for contactless payment applications.

The unprecedented price/performance and low-power operation of the MicroPass 4000 product suite will aid contactless technology to move beyond payments to a broad range of high-convenience mass-market applications, including transit fare systems, access control and loyalty programs, as well as a host of lightweight identification applications.

The INSIDE MicroPass 4000 product suite has been built upon the award-winning and market-leading MicroPass L4-1G and L4-2G products, which have been utilized by more than 25 issuers to deploy more than 35 million units in 2006 and 2007. Flexible packaging options enable manufacturers to purchase MicroPass 4000 solutions in multiple configurations, including wafer, module and inlay forms for use in card, fob, mobile handset sticker and ticket form factors.

“The MicroPass 4000 product suite gives INSIDE a powerful platform for future growth, providing a growing family of highly optimized and very scalable solutions for payment and other related application markets,” comments Charles Walton, EVP, payments, INSIDE Contactless. “Later this year we look forward to introducing several additional MicroPass 4000 family products to support additional payment applications as well as non-payment applications that are very well suited to this platform.”

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